TEPIC^®

TEPIC®, Tris (2,3-Epoxy propyl) Isocyanurate, is a unique symmetrical triazine contains
tri-functional epoxy compound which entirely different from conventional bisphenol
type epoxy resin. TEPIC is well suited for electronic coatings and plays a crucial role as the the cross-linker integrity of solder mask, in tranparency of LEDs, and in outdoor durability of powder coating.

Applications of TEPIC

TEPIC consists of triazine nucleus and three glycidyl group. TEPIC triazine nucleus imparts outdoor durability due to low UV absorption.
TEPIC three glycigyl group imparts high heat resistance due to high cross link density. TEPIC has a wide variety of industrial applications such as:

• Print circuit board (PCB)
  – Top-coated ink
  – Solder-resistant ink (PCB solder mask)
  
– High performance SRI for PC and Cell Phone
– Short circuit prevention: Permanent protective coating of PCB
– Increased heat and solvent resistance
– Resolving power up
• Transparent encapsulate (LED, CCD)
• Semiconductor encapsulate
• Plastic, rubber, and adhesive additive
• Outdoor polyester powder coating
  

Properties of TEPIC

• High cross-linking density with excellent heat
  resistance & thermosetting performance.
• Minimum UV and lighting absorption provide with superb
  visibility.
• Disperse fine powder with suspension stability for
  reactive latency.
• Low chlorine contents, inhibit deterioration ＆electrolytic
  corrosion.

TEPIC ®	G	S	SP	SS
Appearance	Granule	Powder	Fine Powder	Powder
Particle Size (nm)	4-42 mesh 99%	42 mesh pass > 99%	2.0 μm > (Median)	42 mesh pass > 99%
Melting Point °C	90-125	95-125	95-125	99-125
Epoxy Equivalent Weight (g/equiv.)	< 110	< 105	< 105	< 102
ECH content (ppm)	< 100	Not Detected	Not Detected	Not Detected
Hydrolyzable Chlorine (%)	< 2.0	< 0.15	< 0.15	< 0.03
Viscosity (CPS) 120°C	< 100	< 100	< 100	< 100

TEPIC-S／DGEBA ratio and Tg

Solubility of TEPIC-S

TEPIC has high crystallization, high melting point, and hard solubility.